The first edition of the guideline on component cleanliness was published in 2013. The understanding of technical cleanliness has significantly increased in the meantime. In addition, VDA 19 has also been updated. These developments have 2019 been addressed in the second edition of the guideline on component cleanliness. As well as several changes which ensure continuing compliance with VDA 19, some chapters have been extended. For example, the empirical values for components have been updated and expanded and a ‘clarification form’ for the cleanliness analysis has been proposed.

New content has also been added. For instance, the guideline now includes a calculation tool based on a scientific approach to assessing the risk of an electrical short circuit caused by conductive particles. Furthermore, it covers topics such as environmental cleanliness, data management, and cleanliness-controlled design as well as examining other related topics such as whiskers, film residues, ionic and biological contamination.

IEC TR 61191-7:2020 - international consideration of technical cleanliness in electronics assembly

Based on the ZVEI guideline, the topic of technical cleanliness of electrical components and PCB assemblies is also addressed internationally with the guideline IEC TR 61191-7:2020. This part of IEC 61191 serves as a technical report and provides information on how to evaluate technical cleanliness in electronics assembly. It covers the sources, analysis, reduction, control and associated risks of particle contamination on components and electronic assemblies in the electronics industry.

Click here for the ZVEI guideline (in German)... 

Click here for the ZVEI online platform "Component cleanliness" with risk assessment tool (in German)...